A mobile handset must operate over an increasing number of frequency bands, where each band it's having its own specific constraints. The radio frequency architecture therefore becomes more complex, consumes more power and generates an increase in the Bill Of Materials for LTE-Advanced. In general, today's multi-band, multi-mode handset contains multiple RF Front End components and modules (FEM) which are optimized for multiple frequency bands. This leads to component duplication and complex RF hardware as well as to an increased component count. Moreover, the platform customization of each end application and regional variant requires advanced engineering, further escalating the development costs. Until now, size reduction and increased functionality per unit area have been addressed by continued chip scaling. This has reached a point where the passive RF components (high-Q inductors, ceramic filters, SAW filters, varactor diodes and PIN diode switches) have become the limiting factor for volumetric scaling.

For decades, the semiconductor industry has focused on increasing the density of circuits to address high-volume applications for the consumer electronics market. This scaling follows the well- known “Moore's Law”. As this path of technology scaling reaches the physical limits of “Moore's Law”, the microelectronics industry has responded by engaging in tremendous R&D efforts in system integration of heterogeneous technologies. More than ever, new solutions for increased RF hardware integration (more compact) and improved RF performances are needed. For the antenna switch application, the existing Silicon-On-Insulator (SOI) technologies are facing challenges and limitations in terms of linearity, isolation and insertion loss. As an alternative, RF MEMS (RadioFrequency Micro Electro Mechanical Systems) technologies have generated high expectations for such applications due to their enhanced technical features and promising electrical performances. Up to this date, the cost, reliability and manufacturing yield issues have prevented RF MEMS from achieving commercial success and extensive integration into microelectronics systems. Nevertheless, RF MEMS remains an attractive option given its superior attributes to respond to the challenges of the “More than Moore's Law” trend.